JWJ Search

38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017
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1 Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint   
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo
Journal of Welding and Joining:1-6.  Publication Date (Web): June 30, 2017
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26 Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint   
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
Journal of Welding and Joining:26-34.  Publication Date (Web): February 29, 2016   Cited by 2
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37 Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung
Journal of Welding and Joining:37-43.  Publication Date (Web): March 21, 2008
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31 Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, Seung-Boo Jung
Journal of Welding and Joining:31-36.  Publication Date (Web): March 21, 2008
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17 Electrical Characterization of Electronic Package
Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Journal of Welding and Joining:17-23.  Publication Date (Web): March 21, 2008
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78 Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder
Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung
Journal of Welding and Joining:78-83.  Publication Date (Web): January 28, 2008
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6 Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung
Journal of Welding and Joining:6-15.  Publication Date (Web): May 17, 2007
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10 Core Technology of Electronic Packaging
Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung
Journal of Welding and Joining:10-17.  Publication Date (Web): May 12, 2005
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     Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
  Publication Date (Web): December 4, 2017
[Epub ahead of print]
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