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Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles: Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon; J Weld Join. 2022;40(3):233-241. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.4; Full text PubReader ePub PDF

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste: Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee; J Weld Join. 2021;39(4):376-383. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.5
Cited By 3; Full text PubReader ePub PDF

The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module: Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung; J Weld Join. 2019;37(2):1-6. Published online April 25, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.1
Cited By 1; Full text PubReader ePub PDF

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications: Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon; J Weld Join. 2019;37(2):26-34. Published online April 22, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.5
Cited By 9; Full text PubReader ePub PDF

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2018;36(5):52-60. Published online September 17, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.5.7
Cited By 3; Full text PubReader ePub PDF

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2017;35(6):51-58. Published online December 4, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.6.8
Cited By 6; Full text PubReader ePub PDF

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module: Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.; J Weld Join. 2017;35(5):38-47. Published online September 26, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.5.6
Cited By 9; Full text PubReader ePub PDF

Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint: Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo; J Weld Join. 2017;35(3):1-6. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.1
Cited By 2; Full text PubReader ePub PDF

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint: Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee; J Weld Join. 2016;34(1):26-34. Published online February 29, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.1.26
Cited By 6; Full text PubReader ePub PDF

Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):37-43. Published online March 21, 2008; PDF

Ultrasonic Bonding Technology for Flip Chip Packaging: Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.; J Weld Join. 2008;26(1):31-36. Published online March 21, 2008; PDF

Electrical Characterization of Electronic Package: Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):17-23. Published online March 21, 2008; PDF

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder: Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung; J Weld Join. 2007;25(5):78-83. Published online January 28, 2008; PDF

Flip-chip Bonding Technology and Reliability of Electronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.; J Weld Join. 2007;25(2):6-15. Published online May 17, 2007; PDF

Core Technology of Electronic Packaging: Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung; J Weld Join. 2005;23(2):10-17. Published online May 12, 2005; PDF

Volume 42, No. 1

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,507	Review on Vacuum Laser Beam Welding
3,979	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,740	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,688	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,601	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 8	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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