Warning: fopen(/home/virtual/kwjs/journal/upload/ip_log/ip_log_2024-03.txt): failed to open stream: Permission denied in /home/virtual/lib/view_data.php on line 88 Warning: fwrite() expects parameter 1 to be resource, boolean given in /home/virtual/lib/view_data.php on line 89 Chlorine effect on ion migration for PCBs under temperature-humidity bias test

J Weld Join > Volume 33(3); 2015 > Article
Journal of Welding and Joining 2015;33(3):47-53.
DOI: https://doi.org/10.5781/JWJ.2015.33.3.47    Published online June 30, 2015.
Chlorine effect on ion migration for PCBs under temperature-humidity bias test
Seok-Hwan Huh*, An-Seob Shin*
Correspondence:  Seok-Hwan Huh,
Email: shhuh12@gmail.com
Abstract
By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test (85℃/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that CuClx were formed and grown on Cu trace during the 170℃/3hrs and that CuClx was decomposed into Cu dendrite and Cl2 gas during the 85℃/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.
Key Words: Organic PCB, Short-circuit failure mechanism, Copper, Chlorine, Thermal humidity storage
TOOLS
METRICS Graph View
  • 0 Crossref
  •    
  • 2,062 View
  • 36 Download
Related articles


ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2024 by The Korean Welding and Joining Society.

Developed in M2PI