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1 Lifetime Predictions of Printed Circuit Boards under Biased HAST   
Seok-Hwan Huh
Journal of Welding and Joining:1-6.  Publication Date (Web): April 6, 2018
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47 Chlorine effect on ion migration for PCBs under temperature-humidity bias test   
Seok-Hwan Huh, An-Seob Shin
Journal of Welding and Joining:47-53.  Publication Date (Web): June 30, 2015
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274 Effects of the Electroless Ni-P Thickness and Assembly Process on Solder Ball Joint Reliability   
Ji-Hye Lee, Seok-Hwan Huh, Gi-Ho Jung, Suk-Jin Ham
Journal of Welding and Joining:274-281.  Publication Date (Web): June 30, 2014   Cited by 1
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90 Interfacial Microstructures between Ag Wiring Layers and Various Substrates
Keun-Soo Kim, K. Suganuma, Seok-Hwan Huh
Journal of Welding and Joining:90-94.  Publication Date (Web): November 22, 2011
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16 Development of Sn-Zn Based Low Temperature Lead-Free Solder for Improvement of Oxidation Resistance
Jae-Ean Lee, Keun-Soo Kim, Seok-Hwan Huh
Journal of Welding and Joining:16-23.  Publication Date (Web): November 22, 2011
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