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JWJ > Volume 31(3); 2013 > Article
Journal of KWJS 2013 June;31(3) :76-83.
Published online June 30, 2013.
doi:https://doi.org/10.5781/KWJS.2013.31.3.76
Effect of Bonding Condition on the Tensile Properties of Diffusion Bonded Haynes230
Gil-Mo Kang, Ae-Jeong Jeon, Hong-Kyu Kim, Sung-Suk Hong, Chung-Yun Kang
Agency for Defense Development, Daejeon 305-600, Korea
National Core Research Center(NCRC), Pusan National University, Busan 609-735, Korea
Dept. of Material Science and Engineering, Pusan National University, Busan 609-735, Korea
Correspondence: Chung-Yun Kang  Email: kangcy@pusan.ac.kr
  Published online June 30, 2013
ABSTRACT
This study investigated the effect of bonding temperature and holding time on microstructures and mechanical properties of diffusion bonded joint of Haynes230. The diffusion bonds were performed at the temperature of 950, 1050, and 1150℃ for holding times of 30, 60, 120 and 240 minutes at a pressure of 4MPa under high vacuum condition. The amount of non-bonded area and void observed in the bonded interface decreased with increasing bonding temperature and holding time. Cr-rich precipitates at the linear interface region restrained grain migration at 950℃ and 1050℃. However, the grain migration was observed in spite of short holding time due to the dissolution of precipitates to base metal in the interface region at 1150℃. Three types of the fracture surface were observed after tensile test. The region where the coalesce and migration of grain occurred much showed high fracture load because of base metal fracture whereas the region where those did less due to the precipitates demonstrated low fracture load because of interface fracture. The expected fracture load could be derived with the value of fracture area of base metal (ABF) and interface (AIF), Load=201ABF+153AIF. Based on this equation, strength of base metal and interface fracture were calculated as 201MPa and 153MPa, respectively.
Keywords: Ni-base superalloy | Haynes230 | Diffusion bonding | Tensile properties | microstructure | Bonding condition
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