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JWJ > Volume 29(4); 2011 > Article
Journal of KWJS 2011 August;29(4) :54-60.
Published online September 12, 2011.
Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive
Min-Su Kim, Hae-Yeon Kim, Se-Hoon Yoo, Jong-Hoon Kim, Jun-Ki Kim




Correspondence:   Published online September 12, 2011
ABSTRACT
  Adhesive bonding is one of the most promising joining methods which may substitute for conventional metallurgical joining processes, such as welding, brazing and soldering. Curing behavior and mechanical properties of adhesive joint are largely dependent on the curing agent including hardener and catalyst. In this study, effects of curing system on the curing behavior and single-lap shear strength of epoxy adhesive joint are investigated. Dihydrazide, anhydride and dicyandiamide(DICY) were chosen as hardener and imidazole and triphenylphosphine(TPP) were chosen as catalyst. In curing behavior, TPP showed the delay of the curing rate for DICY and ADH at 160℃, compared to imidazole catalyst due to the high curing onset/peak temperature. DICY seemed to be most beneficial in the joint strength for both steel and Al adherends, although the type of adherends affected the shear strength of epoxy adhesive joint.
Keywords: Epoxy adhesive;Curing agent;Curing behavior;Joint strength
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