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366 Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module   
Seungju Baek, Dong-Yurl Yu, Jun-Hyuk Son, Junghwan Bang, Jungsoo Kim, Min-Su Kim, Han-Bo-Ram Lee, Yong-Ho Ko
Journal of Welding and Joining:366-373.  Publication Date (Web): August 24, 2020
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 2
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1 Precise Joining Technology on Flexible Substrate by Using Micro-bumps
Min-Su Kim, Chang-Woo Lee
Journal of Welding and Joining:1-3.  Publication Date (Web): November 30, 2012
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54 Effect of Curing Agent on the Curing Behavior and Joint Strength of Epoxy Adhesive
Min-Su Kim, Hae-Yeon Kim, Se-Hoon Yoo, Jong-Hoon Kim, Jun-Ki Kim
Journal of Welding and Joining:54-60.  Publication Date (Web): September 12, 2011
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