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Journal of KWJS 2009;27(3):32-37.
Published online July 6, 2009.
ACF를 이용한 3차원 패키지의 제조 공정에 대한 연구
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Study on Fabrication of 3-Dimensional Stacked Chip Package with Anisotropic Conductive Film
Young-Chul Lee, Jong-Woong Kim, Kwang-Seok Kim, Chong-Hee Yu, Seung-Boo Jung
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