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Journal of KWJS 2008;26(1):44-49.
Published online March 21, 2008.
이방성 도전성 접착제를 이용한 고밀도 전자 패키징 기술
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High-Density Electronic Packaging Technology using Anisotropic Conductive Adhesives
Jin-Woon Lee, SeongHyuk Lee, Jong-Min Kim


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