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51 Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint   
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
Journal of Welding and Joining:51-58.  Publication Date (Web): December 4, 2017
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1 Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint   
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo
Journal of Welding and Joining:1-6.  Publication Date (Web): June 30, 2017   Cited by 1
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21 High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:21-25.  Publication Date (Web): July 18, 2012
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65 Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:65-70.  Publication Date (Web): January 20, 2012
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14 High Speed and Low Cost TSV Filling Technology by Using Molten Solder
Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:14-18.  Publication Date (Web): July 7, 2011
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17 Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package
Sehoon Yoo, Chang-Woo Lee
Journal of Welding and Joining:17-22.  Publication Date (Web): July 6, 2009
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