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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2018;36(5):52-60.   Published online September 17, 2018
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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2017;35(6):51-58.   Published online December 4, 2017
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Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo
J Weld Join. 2017;35(3):1-6.   Published online June 30, 2017
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High Speed TSV Filling Technology by using Molten Solder and Fabrication of Composite Solder as Filler Material
Young-Ki Ko, Myung-Suk Kang, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2012;30(3):21-25.   Published online July 18, 2012
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Interfacial Microstructure and Mechanical Property of Au Stud Bump Joined by Flip Chip Bonding with Sn-3.5Ag Solder
Young-Kyu Lee, Yong-Ho Ko, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(6):65-70.   Published online January 20, 2012
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High Speed and Low Cost TSV Filling Technology by Using Molten Solder
Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2011;29(3):14-18.   Published online July 7, 2011
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Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package
Sehoon Yoo, Chang-Woo Lee
J Weld Join. 2009;27(3):17-22.   Published online July 6, 2009
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