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38 Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module   
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining:38-47.  Publication Date (Web): September 26, 2017
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19 A study of joint properties of Sn-Cu-(X)Al(Si) middle-temperature solder for automotive electronics modules   
Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang, Chang-Woo Lee
Journal of Welding and Joining:19-24.  Publication Date (Web): June 30, 2015   Cited by 1
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54 Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module   
Junghwan Bang, Dong-Yurl Yu, Yong-Ho Ko, Jeonghan Kim, Chang-Woo Lee
Journal of Welding and Joining:54-58.  Publication Date (Web): November 5, 2013
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85 Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Journal of Welding and Joining:85-89.  Publication Date (Web): March 12, 2009
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