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62 Evaluation of SS 275 Substrate Substitutability in Arc and Wire Additive Manufacturing of Inconel 718   
Tae Hyun Lee, Je Hoon Oh, Dong-Hyuck Kam
Journal of Welding and Joining:62-68.  Publication Date (Web): January 25, 2019
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4 Study on Joint of Micro Solder Bump for Application of Flexible Electronics   
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining:4-10.  Publication Date (Web): June 30, 2013   Cited by 2
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90 Interfacial Microstructures between Ag Wiring Layers and Various Substrates
Keun-Soo Kim, K. Suganuma, Seok-Hwan Huh
Journal of Welding and Joining:90-94.  Publication Date (Web): November 22, 2011
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