Study on Joint of Micro Solder Bump for Application of Flexible Electronics
Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee
Journal of Welding and Joining. 2013;31(3):4-10.   Published online 2013 Jun 30     DOI: https://doi.org/10.5781/KWJS.2013.31.3.4
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