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1 Lifetime Predictions of Printed Circuit Boards under Biased HAST   
Seok-Hwan Huh
Journal of Welding and Joining:1-6.  Publication Date (Web): April 6, 2018
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47 Chlorine effect on ion migration for PCBs under temperature-humidity bias test   
Seok-Hwan Huh, An-Seob Shin
Journal of Welding and Joining:47-53.  Publication Date (Web): June 30, 2015
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288 Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine   
A Young Kim, Won Sik Hong
Journal of Welding and Joining:288-294.  Publication Date (Web): June 30, 2014
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59 Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions   
Yun-Seong Jo, A Young Kim, Won Sik Hong
Journal of Welding and Joining:59-63.  Publication Date (Web): November 5, 2013
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