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Journal of KWJS 2004;22(1):65-70.
Published online March 12, 2004.
[연구논문]종방향 초음파를 이용한 Au 범프의 솔더링 공정
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Soldering Process of Au Bump using Longitudinal Ultrasonic
JungH. Kim, Jihye Lee, ChoongD. Yoo, DooS. Choi
Abstract
A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder. The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.
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