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JWJ > Volume 33(3); 2015 > Article
Journal of Welding and Joining 2015 June;33(3) :25-31.
Published online June 30, 2015.
doi:https://doi.org/10.5781/JWJ.2015.33.3.25
Validation of sequence test method of Pb-free solder joint for automotive electronics
A Young Kim*, Chul Min Oh*, Won Sik Hong*
*Robust Components & System Research Center, Korea Electronics Technology Institute, Gyeonggi-do 463-816, Korea
Correspondence: Won Sik Hong  Email: wshong@keti.re.kr
  Published online June 30, 2015
ABSTRACT
Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from electronic devices and system. Specifically, reliability issue of lead-free solder joint have an increasing demand for the car electronics caused by ELV banning. The authors prepared engine control unit and cabin electronics soldered with Sn-3.0Ag-0.5Cu (SAC305). To compare with the degradation characteristics of solder joint strength, thermal cycling test (TC), power-thermal cycling test (PTC) and series tests were conducted. Series tests were conducted for TC and PTC combined stress test using the same sample in sequence and continuously. TC test was performed at -40~125 ℃ and soak time 10 min for 1000 cycles. PTC test was applied by pulse power and full function conditions during 100 cycles. Combined stress test was tested in accordance with automotive company standard. Solder joint degradation was observed by optical microscopy and environment scanning electron microscopy (ESEM). In addition, to compare with deterioration of bond strength of quad flat package (QFP) and chip components, we have measured lead pull and shear strength. Based on the series test results, consequently, we have validated of series test method for lifetime and reliability of Pb-free solder joint in automotive electronics.
Keywords: Pb-free solder | Solder joint | Series reliability | Automotive electronics | Degradation
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