Impact of External Temperature Environment
on Large FCBGA Sn-Ag-Cu Solder Interconnect
Board Level Mechanical Shock Performance

Lee, Tae-Kyu

doi:2014.32.3.267

J Weld Join > Volume 32(3); 2014 > Article

Research Paper

Journal of Welding and Joining 2014;32(3):267-273.
DOI: https://doi.org/10.5781/JWJ.2014.32.3.53 Published online June 30, 2014.

Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance

Tae-Kyu Lee^*,†

Correspondence: Tae-Kyu Lee,
Email: taeklee@cisco.com

Abstract

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at 100℃ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed

Key Words: Solder, Mechanical shock, FCBGA, Reliability