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JWJ > Volume 29(1); 2011 > Article
Journal of KWJS 2011 February;29(1) :41-45.
Published online March 4, 2011.
Estimation of Mechanical Properties of Sn-xAg-0.5Cu Lead-free Solder by Tensile Test
Jong-Seol Jeong, Ki-Hoon Shin, Jong-Hyeong Kim


Correspondence:   Published online March 4, 2011
ABSTRACT
  SnAgCu lead-free solder alloy is considered as the best alternative to eutectic tin-lead solder. However, the detailed material properties of SnAgCu solder are not available in public. Hence, this paper presents an estimation of mechanical properties of SnAgCu lead-free solder. In particular, the weight percent of Ag was varied as 1.0wt%, 2.5wt%, 3.0wt%, and 4.5wt% in order to estimate the effect of Ag in the Sn-xAg-0.5Cu ternary alloy system. For this purpose, four types of SnAgCu bars were first molded by casting and then standard specimens were cut out of molded bars. Micro-Vickers hardness, tensile tests were finally performed to estimate the variations in mechanical properties according to the weight percent of Ag.
  Test results reveal that the higher the weight percent of Ag is, the higher the hardness, yield strength, and ultimate tensile strength become. More material properties will be further investigated in the future work.
Keywords: SnAgCu lead-free solder;Micro-Vickers hardness test;Tensile test
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