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158 Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors   
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
Journal of Welding and Joining:158-165.  Publication Date (Web): April 29, 2020
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363 Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect   
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
Journal of Welding and Joining:363-368.  Publication Date (Web): August 28, 2019
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