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158 Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors   
Sunghyun Sohn, Daewon Kim, Hongpyo Kim, Namhyun Kang
Journal of Welding and Joining:158-165.  Publication Date (Web): April 29, 2020
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363 Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect   
Sunghyun Sohn, Jeonga Kim, Yujin Park, Kyung Mox Cho, Namhyun Kang
Journal of Welding and Joining:363-368.  Publication Date (Web): August 28, 2019
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313 Microstructure and Mechanical Properties of Friction-Welded Alloy 718 and SNCRW Stainless Steel After Post-Weld Heat-Treatment   
Jeoung Han Kim, Nam-Yong Kim, Yu Sik Kong, Nho Kwang Park
Journal of Welding and Joining:313-317.  Publication Date (Web): August 30, 2019
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45 The Bonding Strength Characteristic of the Filler Metal Powder on the TLP Bonded Region of Superalloy GTD-111DS
In-Seok Oh, Gil-Moo Kim, Byeong-Shik Moon
Journal of Welding and Joining:45-50.  Publication Date (Web): December 3, 2007
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64 Dissolution Phenomenon of the Base Metal during TLP Bonding Using the Modified Base Metal Powder and Ni Base Filler Metal Powder
Woo-young Song, Chang-ho Ye, Chung-yun Kang
Journal of Welding and Joining:64-71.  Publication Date (Web): July 19, 2007
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