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J Weld Join. 2014;32(3):288-294. Published online June 30, 2014.
DOI: https://doi.org/10.5781/JWJ.2014.32.3.74
- Degradation Characteristics of Eutectic and Pb-free Solder Joint
of Electronics mounted for Automotive Engine
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A Young Kim*, Won Sik Hong*,†
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- Corresponding author: Won Sik Hong ,Email: wshong@keti.re.kr
- Abstract
- Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive
electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of
lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016.
We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305)
solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions
of automobile environment such as cabin and engine room. Thermal cycle test (TC, -40 ℃ ~ (85 ℃ and 125 ℃),
1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with
eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin
and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation
level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room
ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field
condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.
Keywords :Automotive, Solder joint, Degradation, Failure mechanism, Electronic control unit (ECU)
