- Research Papers Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
- Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
- J Weld Join. 2022;40(3):225-232.
- Review Papers Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
- Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
- J Weld Join. 2021;39(1):89-102.