Journal of Welding and Joining

Search

Close

Research Papers Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
J Weld Join. 2023;41(6):558-565.
Research Papers Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics
Won Sik Hong, Mi-Song Kim, Joo Young Bae, So-Hee Hyun, Heehun Bae, Joon-Seok Kyeong, Eun-Jeong Park, Jongeul Kim, Ju-Seok Oh
J Weld Join. 2023;41(6):519-527.
Research Papers Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.
Research Papers Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
J Weld Join. 2023;41(5):379-386.
Research Papers Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(4):265-274.
Research Papers Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.
Research Papers Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.
Research Papers Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.
Research Papers Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
J Weld Join. 2021;39(6):677-683.
Research Papers Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.
Research Papers Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.
Research Papers MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.
Research Papers Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.
Research Papers Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
J Weld Join. 2019;37(2):15-20.
Research Papers Cu Corrosion Test Method for Lead-Free Solders
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
J Weld Join. 2017;35(3):21-27.

Go to Top