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Research Papers
Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
- Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
- J Weld Join. 2023;41(6):558-565.
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Research Papers
Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics
- Won Sik Hong, Mi-Song Kim, Joo Young Bae, So-Hee Hyun, Heehun Bae, Joon-Seok Kyeong, Eun-Jeong Park, Jongeul Kim, Ju-Seok Oh
- J Weld Join. 2023;41(6):519-527.
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Research Papers
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
- So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
- J Weld Join. 2023;41(5):387-395.
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Research Papers
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
- Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
- J Weld Join. 2023;41(5):379-386.
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Research Papers
Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
- Hye Min Lee, Mi-Song Kim, Won Sik Hong
- J Weld Join. 2023;41(4):265-274.
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Research Papers
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
- Myeongin Kim, Won Sik Hong, Mi-Song Kim
- J Weld Join. 2022;40(3):271-277.
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Research Papers
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
- Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
- J Weld Join. 2022;40(3):207-214.
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Research Papers
Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
- Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
- J Weld Join. 2022;40(2):165-174.
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Research Papers
Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
- Won Sik Hong, Mi-Song Kim, Myeongin Kim
- J Weld Join. 2021;39(6):677-683.
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Research Papers
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
- Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
- J Weld Join. 2021;39(4):368-375.
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Research Papers
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
- Mi-Song Kim, Won Sik Hong, Myeongin Kim
- J Weld Join. 2021;39(4):359-367.
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Research Papers
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
- Won Sik Hong, Mi-Song KIm, Myeongin Kim
- J Weld Join. 2021;39(4):349-358.
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Research Papers
Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
- Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
- J Weld Join. 2021;39(4):343-348.
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Research Papers
Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
- Mi-Song Kim, Chulmin Oh, Won Sik Hong
- J Weld Join. 2019;37(2):15-20.
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Research Papers
Cu Corrosion Test Method for Lead-Free Solders
- Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
- J Weld Join. 2017;35(3):21-27.