- Research Papers Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
- Doyeop Namgoong, Jong-Hyun Lee
- J Weld Join. 2022;40(3):248-255.
- Review Paper Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
- Na Yeon Lee, Jong-Hyun Lee, Chang-Yong Hyun
- J Weld Join. 2019;37(5):482-492.
- Research Papers High-speed Sintering of Ag-based Composite Ink by Nano-soldering
- Woo Lim Choi, Jong-Hyun Lee
- J Weld Join. 2018;36(2):7-13.
- Special Issues Epoxy solder paste and its applications
- Jong-Tae Moon, Yong-Sung Eom, Jong-Hyun Lee
- J Weld Join. 2015;33(3):32-39.
- TSV Interconnection Technology Using Solder Nanoparticles
- Jong-Hyun Lee, Jong-Ho Yoon, Chang-Yong Hyun
- Journal of KWJS. 2011;29(3):27-34.
- Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
- Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
- Journal of KWJS. 2007;25(2):37-42.
- Necessity of Low Melting Temperature Pb-free Solder Alloy and Characteristics of Representative Alloys
- Jong-Hyun Lee, Nam-Hyun Kang, Chang-Woo Lee, Jeong-Han Kim
- Journal of KWJS. 2006;24(2):17-28.