Journal of Welding and Joining

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Research Papers Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.

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