Volume 37 Issue 2

Research Papers The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module

Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung

J Weld Join. 2019;37(2):1-6.

Review Papers Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications

Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung

J Weld Join. 2019;37(2):7-14.

Research Papers Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module

Mi-Song Kim, Chulmin Oh, Won Sik Hong

J Weld Join. 2019;37(2):15-20.

Research Papers Effect of Air-HAST Conditions on Sn Whisker Growth

Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo kIM

J Weld Join. 2019;37(2):21-25.

Research Papers Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications

Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon

J Weld Join. 2019;37(2):26-34.

Research Papers Microtexture and Microstructural Evolution of Friction Stir Welded AA5052-H32 Joints

Young-Bin Lim, Kwang-Jin Lee

J Weld Join. 2019;37(2):35-40.

Review Papers A Review on Twin Tungsten Inert Gas Welding Process Accompanied by Hot Wire Pulsed Power Source

Prassan Shah, Chetan Agrawal

J Weld Join. 2019;37(2):41-51.

Review Papers Ultrasonic and Laser Welding Technologies on Al/Cu Dissimilar Materials for the Lithium-Ion Battery Cell or Module Manufacturing

Minjung Kang, Woo Seong Choi, Sanghoon Kang

J Weld Join. 2019;37(2):52-59.

Research Papers Optimization of PWHT on Dissimilar Friction Welding for Piping Material of A105 to A312

Yu-Sik Kong, Young Whan Park

J Weld Join. 2019;37(2):60-65.

Research Papers Statistical Analysis of Korean Welding Industry (IV)

Seungjae Lee, Cheolhee Kim

J Weld Join. 2019;37(2):66-69.