Journal of Welding and Joining

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Volume 25 Issue 2

Laser Micro Bonding Technology
Joohan Kim, Chulku Lee
Journal of KWJS. 2007;25(2):1-2.
Ways to Improve Reliability against Stress-Relief Cracking in Weld Metal
Hee-Jin Kim, Hoi-Soo Ryoo
Journal of KWJS. 2007;25(2):3-5.
Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung
Journal of KWJS. 2007;25(2):6-15.
Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement
Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung
Journal of KWJS. 2007;25(2):16-23.
Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
Journal of KWJS. 2007;25(2):24-30.
Recent Advances on Conductive Adhesives in Electronic Packaging
Jong-Min Kim
Journal of KWJS. 2007;25(2):31-36.
Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
Journal of KWJS. 2007;25(2):37-42.
A Study on the Mechanical Properties of Joints in Laser Transmission Joining of Polymers
Sang-Woo Cha, Jin-Beom Kim, Suk-Hwan Yoon, Suck-Joo Na
Journal of KWJS. 2007;25(2):43-48.
Automatic Multi-torch Welding System with High Speed
Hyeong-Soon Moon, Sung-Hoon Ko, Yong-Baek Kim
Journal of KWJS. 2007;25(2):49-54.
Mechanical Properties of the Flash Butt Welded Joint of 590MPa High Strength Steel
Boyoung Jeong, In-Su Woo, Jeong-Kil Kim, Jong-Bong Lee
Journal of KWJS. 2007;25(2):55-61.
Prediction Model for the Microstructure and Properties in Weld Heat Affected Zone : Ⅳ. Critical Particle Size for the Particle Coarsening Kinetics in Weld HAZ of Ti Added Low Alloyed Steel
Joonoh Moon, Sanghoon Kim, Hongchul Jeong, Jongbong Lee, Changhee Lee
Journal of KWJS. 2007;25(2):62-69.
Development of Simplified Formulas to Predict Deformations in Plate Bending Process with Oxy-Propane Gas Flame
Kang-Yul Bae, Young-Soo Yang, Chung-Min Hyun, Si-Hun Cho
Journal of KWJS. 2007;25(2):70-75.
Fabrication of Solder Bump Pattern Using Thin Mold
Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
Journal of KWJS. 2007;25(2):76-81.
Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
Journal of KWJS. 2007;25(2):82-88.
IWJC-Korea 2007 Final Program
편집부
Journal of KWJS. 2007;25(2):89-89.
Welcome Messages
Dong-Hwan Park, Suck-Joo Na
Journal of KWJS. 2007;25(2):90-90.
News of the Korean Welding and Joining Society etc.
편집부
Journal of KWJS. 2007;25(2):107-111.
News of the Members etc.
편집부
Journal of KWJS. 2007;25(2):112-120.

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