Previous issues
Volume 25 Issue 2
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Laser Micro Bonding Technology
- Joohan Kim, Chulku Lee
- Journal of KWJS. 2007;25(2):1-2.
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Ways to Improve Reliability against Stress-Relief Cracking in Weld Metal
- Hee-Jin Kim, Hoi-Soo Ryoo
- Journal of KWJS. 2007;25(2):3-5.
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
- Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung
- Journal of KWJS. 2007;25(2):6-15.
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Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement
- Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung
- Journal of KWJS. 2007;25(2):16-23.
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Formation of Through-Hole and Cu-Filling for 3 Dimensional Packaging Technology
- Sung-Jun Hong, Ji-Hun Jun, Jae-Pil Jung
- Journal of KWJS. 2007;25(2):24-30.
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Recent Advances on Conductive Adhesives in Electronic Packaging
- Jong-Min Kim
- Journal of KWJS. 2007;25(2):31-36.
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Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
- Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
- Journal of KWJS. 2007;25(2):37-42.
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A Study on the Mechanical Properties of Joints in Laser Transmission Joining of Polymers
- Sang-Woo Cha, Jin-Beom Kim, Suk-Hwan Yoon, Suck-Joo Na
- Journal of KWJS. 2007;25(2):43-48.
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Automatic Multi-torch Welding System with High Speed
- Hyeong-Soon Moon, Sung-Hoon Ko, Yong-Baek Kim
- Journal of KWJS. 2007;25(2):49-54.
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Mechanical Properties of the Flash Butt Welded Joint of 590MPa High Strength Steel
- Boyoung Jeong, In-Su Woo, Jeong-Kil Kim, Jong-Bong Lee
- Journal of KWJS. 2007;25(2):55-61.
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Prediction Model for the Microstructure and Properties in Weld Heat Affected Zone : Ⅳ. Critical Particle Size for the Particle Coarsening Kinetics in Weld HAZ of Ti Added Low Alloyed Steel
- Joonoh Moon, Sanghoon Kim, Hongchul Jeong, Jongbong Lee, Changhee Lee
- Journal of KWJS. 2007;25(2):62-69.
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Development of Simplified Formulas to Predict Deformations in Plate Bending Process with Oxy-Propane Gas Flame
- Kang-Yul Bae, Young-Soo Yang, Chung-Min Hyun, Si-Hun Cho
- Journal of KWJS. 2007;25(2):70-75.
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Fabrication of Solder Bump Pattern Using Thin Mold
- Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
- Journal of KWJS. 2007;25(2):76-81.
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Activation Energy for Intermetallic Compound Formation of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu Solder Joints
- Won-Sik Hong, Whee-Sung Kim, Noh-Chang Park, Kwang-Bae Kim
- Journal of KWJS. 2007;25(2):82-88.
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IWJC-Korea 2007 Final Program
- 편집부
- Journal of KWJS. 2007;25(2):89-89.
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Welcome Messages
- Dong-Hwan Park, Suck-Joo Na
- Journal of KWJS. 2007;25(2):90-90.
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News of the Korean Welding and Joining Society etc.
- 편집부
- Journal of KWJS. 2007;25(2):107-111.
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News of the Members etc.
- 편집부
- Journal of KWJS. 2007;25(2):112-120.