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Journal of KWJS 2005;23(2):52-58.
Published online May 12, 2005.
[연구논문]니켈기 초내열 합금의 천이액상확산접합 특성에 미치는 접합 온도 및 가열 속도의 영향
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Effect of Bonging Temperature and Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Base Superalloy
Woo-Hyuk Choi, Sung-Wook Kim, Jong-Hyun Kim, Gil-Young Kim, Chang-Hee Lee
Abstract
This study was carried out to investigate the effect of bonding temperature and heating rate on transient liquid phase diffusion bonding of Ni-base superalloy. The heating was varied by 0.1℃/sec, 1℃/sec, 10℃/sec to the bonding temperatures 1100℃, 1150℃, 1200℃ under vacuum. As bonding temperature increased, maximum dissolution width of base metal increased, but a dissolution finishing time decreased. The eutectic width of insert metal in the bonded interlayer decreased linearly in proportion to the square root of holding time during isothermal solidification stage. The bonding temperature was raised, isothermal solidification rate slightly increased. As the heating rate decreased and the bonding temperature increased, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification became reduced.


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