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JWJ > Volume 23(2); 2005 > Article
Journal of KWJS 2005 April;23(2) :52-58.
Published online May 12, 2005.
Effect of Bonging Temperature and Heating Rate on Transient Liquid Phase Diffusion Bonding of Ni-Base Superalloy
Woo-Hyuk Choi, Sung-Wook Kim, Jong-Hyun Kim, Gil-Young Kim, Chang-Hee Lee




Correspondence:   Published online May 12, 2005
ABSTRACT
This study was carried out to investigate the effect of bonding temperature and heating rate on transient liquid phase diffusion bonding of Ni-base superalloy. The heating was varied by 0.1℃/sec, 1℃/sec, 10℃/sec to the bonding temperatures 1100℃, 1150℃, 1200℃ under vacuum. As bonding temperature increased, maximum dissolution width of base metal increased, but a dissolution finishing time decreased. The eutectic width of insert metal in the bonded interlayer decreased linearly in proportion to the square root of holding time during isothermal solidification stage. The bonding temperature was raised, isothermal solidification rate slightly increased. As the heating rate decreased and the bonding temperature increased, the completion time of dissolution after reaching bonding temperature decreased. When the heating rate was very slow, the solidification proceeded before reaching bonding temperature and the time required for the completion of isothermal solidification became reduced.
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