Advanced Search  
JWJ > Volume 21(2); 2003 > Article
Journal of KWJS 2003 April;21(2) :97-101.
Published online April 25, 2003.
Shear Strength and Aging Characteristics in Solder Bumps for High Reliability Optical Module
유정희
Correspondence:   Published online April 25, 2003
TOOLS
PDF Links  PDF Links
Full text via DOI  Full text via DOI
Download Citation  Download Citation
CrossRef TDM  CrossRef TDM
  E-Mail
Share:      
METRICS
1,086
View
0
Download
Related article
Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module  2017 October;35(5)
Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module  2017 October;35(5)
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of KWJS for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of KWJS e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of KWJS e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society.           Developed in M2PI