Effect of Plaama Treatment on the Bond Strength of Sn-Pb Eutectic Solder Flip Chip

Journal of KWJS 2002;20(4):92-98.
Published online August 26, 2002.

Sn-Pb 공정솔더 플립칩의 접합강도에 미치는 플라즈마 처리 효과

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Effect of Plaama Treatment on the Bond Strength of Sn-Pb Eutectic Solder Flip Chip

홍순민, 강순칙, 정재필

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