The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints

이창배,; 이창열,; 서창제,; 정승부,

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Journal of KWJS 2002;20(3):16-23.
Published online June 25, 2002.

무연솔더 접합 계면의 금속간화합물 생성 및 성장

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The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints

이창배, 이창열, 서창제, 정승부

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