Thermal Fatigue Life Prediction of μBGA Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder

신영의,; 이준환,; 하범용,; 정승부,; 정재필,

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Journal of KWJS 2001;19(4):44-50.
Published online August 27, 2001.

Sn-37mass%Pb 솔더 및 Sn-3.5mass%Ag 무연솔더를 이용한 Μbga 솔더 접합부의 열피로수명 예측

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Thermal Fatigue Life Prediction of μBGA Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead-free Solder

신영의, 이준환, 하범용, 정승부, 정재필

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