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JWJ > Volume 30(6); 2012 > Article
Journal of KWJS 2012 December;30(6) :1-5.
Published online December 23, 2012.
doi:https://doi.org/10.5781/KWJS.2012.30.6.1
Joint Reliability of Sn3.5Ag, Sn0.7Cu and Sn5.0Sb Pb-free Solder and Hybrids Joining Process for Application of Automobile Electric Module
Myong-Suk Kang*, Jung-Hwan Bang**, Chang-Woo Lee**
*Dept. Electronic Packaging, University of Science & Technology
Correspondence: Chang-Woo Lee  Email: cwlee@kitech.re.kr
  Published online December 23, 2012
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