Effect of Bonding Temperature and Bonding Pressure on Deformation and Tensile Properties of Diffusion Bonded Joint of STS304 Compact Heat Exchanger |
Ae-Jeong Jeon*, Tae-Jin Yoon*, Sang-Ho Kim**, Hyeon-Jun Kim***, Chung-Yun Kang** |
*National Core Research Center(NCRC), Pusan National University, Busan 609-735, Korea **Dept. of Material Science and Engineering, Pusan National University, Busan 609-735, Korea ***DongHwa Entec Co., Ltd. R&D Center, Busan 618-230, Korea |
Correspondence:
Chung-Yun Kang Email: kangcy@pusan.ac.kr Published online August 30, 2014
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In this study, the effect of bonding temperature and bonding pressure on deformation and tensile properties of diffusion bonded joint of STS304 compact heat exchanger was investigated. The diffusion bonds were prepared at 700, 800 and 900℃ for 30, 60 and 90 min in pressure of 3, 5, and 7 MPa under high vacuum condition. The height deformation of joint decreased and the width deformation of joint increased with increasing bonding pressure at 900℃. The ratio of non-bonded layer and void observed in the joint decreased with increasing bonding temperature and bonding pressure. Three types of the fracture surface were observed after tensile test. The non-bonded layer was observed in diffusion bonded joint preformed at 700℃, the non-bonded layer and void were observed at 800℃. On the other hand, the ductile fracture occurred in diffusion bonded joint preformed at 900℃. Tensile load of joint bonded at 800℃ was proportional to length of bonded layer and tensile load of joint bonded at 900℃ was proportional to minimum width of pattern. The tensile strength of joint was same as base metal. |
Keywords:
AISI 304 stainless steel | Diffusion bonding | Tensile properties | Compact heat exchanger
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