| Fabrication and Reliability Test of Device Embedded Flexible Module |
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Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee |
Correspondence:
Won Sik Hong,
Email: wshong@keti.re.kr
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| Abstract |
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These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product. |
| Key Words:
Flexible module, Embedded device, Thin wafer, Reliability test, Bendable |
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