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JWJ > Volume 30(3); 2012 > Article
Journal of KWJS 2012 June;30(3) :15-20.
Published online July 18, 2012.
doi:https://doi.org/10.5781/KWJS.2012.30.3.15
Adhesion Measurement Methods for Thin Films in Microelectronics
Taek-Soo Kim
Correspondence:   Published online July 18, 2012
ABSTRACT
  Diagnosing and improving adhesion of advanced packaging and thin films is an essential part of the research and development in microelectronics. In this paper, the four-point bend test and the double cantilever beam test among various adhesion measurement methods are reviewed.
Keywords: Adhesion;Fracture;Thin film;Microelectronics
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