High Speed and Low Cost TSV Filling Technology by Using Molten Solder

Ko, Young-Ki; Han, Min-Kuy; Yoo, Sehoon; Lee, Chang-Woo

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Journal of KWJS 2011;29(3):14-18.
Published online July 7, 2011.

용융 솔더를 이용한 초고속, 저단가 TSV 충진

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High Speed and Low Cost TSV Filling Technology by Using Molten Solder

Young-Ki Ko, Min-Kuy Han, Sehoon Yoo, Chang-Woo Lee

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