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Journal of KWJS 2010;28(6):35-39.
Published online January 10, 2011.
질화규소 세라믹의 레이저 예열선삭에 관한 연구 (Ⅲ) - SSN 및 HIPSN의 예열선삭시 절삭력 및 공구수명의 특성
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A Study on Laser Assisted Machining for Silicon Nitride Ceramics (Ⅲ) - Variation of the Main Cutting Force and Life of Cutting Tool by LAM of SSN and HIPSN
Jong-Do Kim, Su-Jin Lee, Tae-Young Kang, Jeong Suh, Jae-Hoon Lee
Abstract
  Generally, ceramic material is very difficult to machine due to high strength and hardness. However, ceramic material can be machined at high temperature by plastic flow as metallic material due to the deterioration of the grain boundary glassy phase. Recently, a new method was developed to execute cutting process with CBN cutting tool by local heating of surface with laser. There are various parameters in LAM because it is a complex process with laser treatment and machining. During laser assisted machining, high power results in reducing of cutting force and increasing tool life, but excessive power brings oxidation of the surface. The effect of laser power, feed rate, cutting depth and etc. were investigated on the life of cutting tool. Chips were observed to find out suitable machining conditions. Chips of SSN had more flow-types than HIPSN. It means SSN is easier to machining. The life of cutting tool was increased with increasing laser power and decreasing feed rate and cutting depth.
Key Words: Silicon nitride, HPDL, LAM, Oxidation, Softening, Chip, Main cutting force


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