| Sn-1.7Bi-0.7Cu-0.6In 솔더의 특성 연구 |
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| Characteristics of Sn-1.7Bi-0.7Cu-0.6In Lead-free Solder |
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Ji-Ho Park, Hee-Yul Lee, Ji-Heon Jhun, Chu-Seon Cheon, Jae-Pil Jung |
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| Abstract |
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Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at 250℃, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at 250℃ was 71%, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to 260℃. In dross test at 250℃ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC. |
| Key Words:
lead-free solder, Sn-1.7%Bi-0.7%Cu-0.6%In, Sn-3.5%Ag-0.7%Cu, solder characteristics, wetting property |
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