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J Weld Join > Volume 40(5); 2022 > Article |
Woohyeon Ju
https://orcid.org/0000-0002-3140-8004
Taewan Kim
https://orcid.org/0000-0002-0401-9994
Flip-chip Bonding Technology and Reliability of Electronic Packaging2007 April;25(2)
Sinter Diffusion Bonding Technology for Assembly and Hybrid of Materials2006 October;24(5)
Application of Welding Technoloby to Automotive Industry2002 October;20(5)
Trend of Welding Technologies for Improving Productivity 1993 December;11(4)