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Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung
J Weld Join. 2007;25(2):6-15.   Published online 2007 May 17

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Position Force Switching on Flip Chip Machine Bonding Axis
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Reliability assessment of flip chip interconnect electronic packaging under thermal shocks
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Destructive Physical Analysis Methods of Flip Chip Packaging Devices for High Reliability
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Reliable Low-Cost Flip Chip Interconnections
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Electronic Packaging: Flip-chip Attachment
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Flip-chip microcircuit bonding systems
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Reliability of Underfill-Encapsulated Flip-Chip Packages
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A Study on the Joint Properties and Reliability of 25μm Cu/Ni/Sn-3.5Ag Bonding Process with Chip on Chip Thermal Compression Bonding
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A reliability evaluation software for Flip Chip based on failure physics
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Reliability AuSn flip-chip bonding on flexible prints
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