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Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding

Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang

J Weld Join. 2023;41(4):291-298. Published online 2023 August 31 DOI: https://doi.org/10.5781/JWJ.2023.41.4.8

Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding

Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang

Journal of Welding and Joining. 2023;41(4):291-298

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Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder

Wenzhao Li, Zhijie Ding, Haitao Xue, Weibing Guo, Cuixin Chen, Yang Jia, Zheng Wan

Materials Characterization. 2023;199:112833

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Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers

Abdulaziz AlHazaa, Muhammad Shar, Anas Atieh, Hiroshi Nishikawa

Metals. 2018;8(1):60

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Interfacial Microstructure and Bonding Area of Sn-based Alloy-GG25 Gray Iron Bimetallic Material Using Flux, Sn, and Sn-Zn Interlayer Compound Casting

N. Fathy

Engineering, Technology & Applied Science Research. 2022;12(2):8416-8420

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Interfacial structures and mechanical properties of Cu/Sn/Cu containing SiC nanowires under transient liquid phase bonding

Mu-lan Li, Liang Zhang, Li-li Gao, Xi Wang, Chen Chen, Xiao Lu

Intermetallics. 2022;148:107641

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Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering

Y. Wu, Z.J. Zhang, L.D. Chen, X. Zhou

Microelectronics International. 2023;

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Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

Ximin Zhang, Hong Guo, Fazhang Yin, Yeming Fan, Yongzhong Zhang

Rare Metals. 2011;30(1):94-98

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Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Gyuwon Jeong, Dong-Yurl Yu, Seongju Baek, Junghwan Bang, Tae-Ik Lee, Seung-Boo Jung, JungSoo Kim, Yong-Ho Ko

Materials. 2021;14(2):335

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Interfacial bonding mechanism and mechanical properties of adding CuZn alloy fibre for Cu/Al composite

Lei Gao, Juntao Zou, Peng Zhang, Lixing Sun, Fei Cao, Shuhua Liang

Materials Characterization. 2022;188:111883

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EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu

H HUANG, X WEI, L ZHOU, X LIU, G GUO

Acta Metallurgica Sinica (English Letters). 2006;19(4):251-257

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