Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Journal of Welding and Joining. 2023;41(4):265-274 
Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Structure of SnAgCu Solder Joints
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). 2020;
Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021;
A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). 2022;
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Journal of Welding and Joining. 2022;40(3):207-214
Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish
Procedia Engineering. 2012;36:419-426
Effect of Surface Finish and Roughness on the Mechanical Strength of Solder Joints
2023 46th International Spring Seminar on Electronics Technology (ISSE). 2023;
Solder Joint Characterization
Assembly and Reliability of Lead-Free Solder Joints. 2020;299-354
A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints
Lead Free Solders. 2019;
Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination
2019 20th International Conference on Electronic Packaging Technology(ICEPT). 2019;