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A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste

Junhyuk Son, Chang-Woo Lee, Dong-Yurl Yu, Dongjin Byun, Junghwan Bang

J Weld Join. 2022;40(6):540-546. Published online 2022 December 30 DOI: https://doi.org/10.5781/JWJ.2022.40.6.10

A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste

Junhyuk Son, Chang-Woo Lee, Dong-Yurl Yu, Dongjin Byun, Junghwan Bang

Journal of Welding and Joining. 2022;40(6):540-546

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Influence of Aging Atmosphere on the Thermal Stability of Low-Temperature Rapidly Sintered Cu Nanoparticle Paste Joint

Jiacheng Xie, Jun Shen, Jinzhao Deng, Xu Chen

Journal of Electronic Materials. 2020;49(4):2669-2676

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Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Sinan Zhang, Zhen Wang, Jie Wang, Guihua Duan, Haixia Li

Materials. 2022;15(14):4756

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Study of the adhesion of a sintered Ag joint on a Cu substrate using laser shocks. Influence of aging

Xavier Milhet, Thibaut de Resseguier, Loic Signor, Etienne Barraud, Kokouvi Happy N'Tsouaglo, Hadi Bahsoum, Jacques Baillargeat

2021 IEEE 71st Electronic Components and Technology Conference (ECTC). 2021;

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High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei

Microelectronics Reliability. 2013;53(1):174-181

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Fatigue and fracture parameters of diffusion alloyed Cu–Ni–Mo sintered steel

M. Šori, T. Vuherer, S. Glodež

Engineering Fracture Mechanics. 2016;153:278-288

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The influence of chromium addition on the metallurgical, mechanical and fracture aspects of Sn–Cu–Bi/Cu solder joint

Roxana Rashidi, Homam Naffakh-Moosavy

Journal of Materials Research and Technology. 2021;15:3321-3336

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Fracture Behavior of IMCs at Cu/Pb-Free Solder Interface

Qingke Zhang

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces. 2015;35-66

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Jointing of Bi-2223 sintered bulk using superconductor paste

Shuetsu Haseyama, Noriyasu Fujinaka, Shuji Yoshizawa, Hiroshi Nakane

Physica C: Superconductivity. 2001;356(1-2):23-30

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Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste

Po-Cheng Shih, Kwang-Lung Lin

Journal of Materials Science. 2007;42(8):2574-2581

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