CrossRef Text and Data Mining
Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.
Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232.   Published online 2022 June 24    DOI: https://doi.org/10.5781/JWJ.2022.40.3.3

Excel Download

Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Journal of Welding and Joining. 2022;40(3):225-232   Crossref logo
Link1 Link2 Link3

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints
Journal of Alloys and Compounds. 2015;627:276-280   Crossref logo
Link1 Link2

Intermetallic Compound Growth between Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Sn-3.5Ag or Sn-3.0Ag-0.5Cu Solder
Journal of Electronic Materials. 2018;47(4):2507-2511   Crossref logo
Link1 Link2 Link3

Intermetallic compound formation in Sn–Co–Cu, Sn–Ag–Cu and eutectic Sn–Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering
Materials Science and Engineering: B. 2006;135(2):134-140   Crossref logo
Link1 Link2

Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration
Acta Materialia. 2013;61(19):7142-7154   Crossref logo
Link1 Link2

Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints
Journal of Materials Science. 2010;45(4):929-935   Crossref logo
Link1 Link2 Link3 Link4

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish
Journal of Electronic Materials. 2012;41(4):763-773   Crossref logo
Link1 Link2 Link3

Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints
2019 IEEE 69th Electronic Components and Technology Conference (ECTC). 2019;   Crossref logo
Link1

Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection
Journal of Electronic Materials. 2018;47(9):5191-5202   Crossref logo
Link1 Link2 Link3

Effect of La on the Growth of Cu6Sn5 Intermetallic Compound for Improved Sn-Pb Solder Joints
MRS Proceedings. 2000;657:   Crossref logo
Link1

This metadata service is kindly provided by CrossRef from May 29, 2014. J Weld Join has participated in CrossRef Text and Data Mining service since October 29, 2014.