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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints

Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim

J Weld Join. 2022;40(3):207-214. Published online 2022 June 20 DOI: https://doi.org/10.5781/JWJ.2022.40.3.1

Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints

Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim

Journal of Welding and Joining. 2022;40(3):207-214

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Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish

Denis Fros, Petr Vesely

2021 44th International Spring Seminar on Electronics Technology (ISSE). 2021;

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Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Structure of SnAgCu Solder Joints

Per-Erik Tegehall

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). 2020;

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Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package

Ja-Myeong Koo, Seung-Boo Jung

Microsystem Technologies. 2007;13(11-12):1567-1573

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Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish

Wei–Hsiang Wu, Sheng–Wei Lin, Yen–Chen Lin, Cheng–En Ho

Procedia Engineering. 2012;36:419-426

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Effect of PCB surface finish on creep properties of lead‐free solder joints

Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen

Soldering & Surface Mount Technology. 2005;17(4):3-9

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Optimization of solder paste quantity considering the properties of solder joints

Martin Hirman, Frantisek Steiner

Soldering & Surface Mount Technology. 2017;29(1):15-22

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Thermal Fitigure Life Prediction on PBGA Solder Joints of Typical Pad Finish/Solder Combination

Hongqin Wang, Qingqiu Gong, Dawei Wang, Wei Li, Ziqiang Xu, Jinbao Cai

2019 20th International Conference on Electronic Packaging Technology(ICEPT). 2019;

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The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Meng‐Kuang Huang, Chiapyng Lee, Pei‐Lin Wu, Shyh‐Rong Tzan

Soldering & Surface Mount Technology. 2005;17(3):3-8

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Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints

Dick R. Casali, Jamie J. Kruzic

Mechanical and Creep Behavior of Advanced Materials. 2017;243-251

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