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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.   Published online 2022 June 20    DOI: https://doi.org/10.5781/JWJ.2022.40.3.1

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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Journal of Welding and Joining. 2022;40(3):207-214   Crossref logo
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Comparative Study Focused on Mechanical Properties of Solder Joints Considering Solder Pad Surface Finish
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Impact of Surface Finish, Solder Volume and Solder Composition on the Grain Structure of SnAgCu Solder Joints
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Effect of surface finish of substrate on mechanical reliability of In-48Sn solder joints in MOEMS package
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Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish
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Optimization of solder paste quantity considering the properties of solder joints
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The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
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Surface Finish Effects on Fracture Behavior of Sn–4Ag–0.5Cu Solder Joints
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