CrossRef Text and Data Mining

Result of CrossRef Text and Data Mining Search is the related articles with entitled article. If you click link1 or link2 you will be able to reach the full text site of selected articles; however, some links do not show the full text immediately at now. If you click CrossRef Text and Data Mining Download icon, you will be able to get whole list of articles from literature included in CrossRef Text and Data Mining.

Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers

Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim

J Weld Join. 2022;40(3):242-247. Published online 2022 June 14 DOI: https://doi.org/10.5781/JWJ.2022.40.3.5

Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers

Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim

Journal of Welding and Joining. 2022;40(3):242-247

Link1

Link2 Link3

Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Jeong Il Lee, Jong-Min Kim

Journal of Welding and Joining. 2019;37(1):76-81

Link1

Link2 Link3

Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers

Jeong Il Lee, Byung-Seung Yim, Mu Seong Yun, Jong-Min Kim

Journal of Materials Science: Materials in Electronics. 2015;27(1):982-991

Link1

Link2 Link3

Isotropic conductive adhesives filled with low-melting-point alloy fillers

D. Lu, C.P. Wong

IEEE Transactions on Electronics Packaging Manufacturing. 2000;23(3):185-190

Link1

Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers

Byung-Seung Yim, Seung Hoon Oh, Jin Sik Jeong, Jong-Min Kim

Journal of Composite Materials. 2012;47(9):1141-1152

Link1 Link2 Link3

Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers

Jeong Il Lee, Byung-Seung Yim, Dongjun Shin, Jong-Min Kim

Journal of Materials Science: Materials in Electronics. 2016;27(6):6223-6231

Link1

Link2 Link3

Novel low melting point alloy-loaded polymer composite. II. Resistivity-temperature behavior

Xiangwu Zhang, Yi Pan, Lie Shen, Xiaosu Yi

Journal of Applied Polymer Science. 2000;77(4):756-763

Link1 Link2

Effect of nano-fillers on conductivity of polyethylene/low melting point metal alloy composites

Gang Chen, Xiao-hong Zhang, Jin-liang Qiao

Chinese Journal of Polymer Science. 2015;33(3):371-375

Link1

Link2 Link3

794. Low melting-point alloy with a bismuth base

Vacuum. 1973;23(10):387

Link1 Link2

Rapid thermal annealing of high-melting-point films on low-melting-point substrates

S.E. Rosenberg, P.Y. Wong, I.N. Miaoulis

IEEE Transactions on Semiconductor Manufacturing. 1996;9(2):249-256

Link1

This metadata service is kindly provided by CrossRef from May 29, 2014. J Weld Join has participated in CrossRef Text and Data Mining service since October 29, 2014.