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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.   Published online 2022 June 14    DOI: https://doi.org/10.5781/JWJ.2022.40.3.5

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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Journal of Welding and Joining. 2022;40(3):242-247   Crossref logo
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Influence of Reductant Content within the Solderable Polymer Composite on the Coalescence and Wetting Behaviors of Low-Melting-Point Alloy Fillers
Journal of Welding and Joining. 2019;37(1):76-81   Crossref logo
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Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers
Journal of Materials Science: Materials in Electronics. 2015;27(1):982-991   Crossref logo
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Isotropic conductive adhesives filled with low-melting-point alloy fillers
IEEE Transactions on Electronics Packaging Manufacturing. 2000;23(3):185-190   Crossref logo
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Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
Journal of Composite Materials. 2012;47(9):1141-1152   Crossref logo
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Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers
Journal of Materials Science: Materials in Electronics. 2016;27(6):6223-6231   Crossref logo
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Novel low melting point alloy-loaded polymer composite. II. Resistivity-temperature behavior
Journal of Applied Polymer Science. 2000;77(4):756-763   Crossref logo
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Effect of nano-fillers on conductivity of polyethylene/low melting point metal alloy composites
Chinese Journal of Polymer Science. 2015;33(3):371-375   Crossref logo
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794. Low melting-point alloy with a bismuth base
Vacuum. 1973;23(10):387   Crossref logo
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Rapid thermal annealing of high-melting-point films on low-melting-point substrates
IEEE Transactions on Semiconductor Manufacturing. 1996;9(2):249-256   Crossref logo
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