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Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Doyeop Namgoong, Jong-Hyun Lee
J Weld Join. 2022;40(3):248-255.   Published online 2022 June 14    DOI: https://doi.org/10.5781/JWJ.2022.40.3.6

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Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Journal of Welding and Joining. 2022;40(3):248-255   Crossref logo
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A thermodynamic study of voiding phenomena in Cu–Cu thermo-compression wafer bonding
Microsystem Technologies. 2017;24(1):815-822   Crossref logo
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Low pressure Cu-Cu bonding using MOD ink-modified Cu particle paste for die-attachment of power semiconductors
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Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device
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Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 2022;   Crossref logo
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Cu-Cu Thermo-Compression Bonding for TSV Integration
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Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding
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Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
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Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding
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