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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online 2022 April 21    DOI: https://doi.org/10.5781/JWJ.2022.40.2.8

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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Journal of Welding and Joining. 2022;40(2):165-174   Crossref logo
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A study of solder paste printing requirements for CSP technology
Soldering & Surface Mount Technology. 2000;12(3):13-19   Crossref logo
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Characterization of a solder paste printing process and its optimization
Soldering & Surface Mount Technology. 1999;11(3):23-26   Crossref logo
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Solder Paste and Flux Technology
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Optimization of solder paste quantity considering the properties of solder joints
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Solder paste
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NBS enhances its manufacturing process control capabilities with 3D solder paste inspection
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Process Modelling Maps for Solder Paste Printing
Soldering & Surface Mount Technology. 1994;6(2):4-11   Crossref logo
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Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques
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Henkel's Multicore® MP218 solder paste formulation delivers robust performance across a wide range of process conditions
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