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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste

Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong

J Weld Join. 2022;40(2):165-174. Published online 2022 April 21 DOI: https://doi.org/10.5781/JWJ.2022.40.2.8

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste

Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong

Journal of Welding and Joining. 2022;40(2):165-174

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A study of solder paste printing requirements for CSP technology

Jeff Kennedy

Soldering & Surface Mount Technology. 2000;12(3):13-19

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Characterization of a solder paste printing process and its optimization

Gary K.K. Poon, D.J. Williams

Soldering & Surface Mount Technology. 1999;11(3):23-26

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Solder Paste and Flux Technology

Shantanu Joshi, Peter Borgesen

Lead‐free Soldering Process Development and Reliability. 2020;73-93

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Optimization of solder paste quantity considering the properties of solder joints

Martin Hirman, Frantisek Steiner

Soldering & Surface Mount Technology. 2017;29(1):15-22

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Solder paste

Mike Judd, Keith Brindley

Soldering in Electronics Assembly. 1999;109-126

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NBS enhances its manufacturing process control capabilities with 3D solder paste inspection

Soldering & Surface Mount Technology. 2010;22(3):

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Process Modelling Maps for Solder Paste Printing

N.N. Ekere, E.K. Lo, S.H. Mannan

Soldering & Surface Mount Technology. 1994;6(2):4-11

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Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques

Ali Sezer, Aytaç Altan

Soldering & Surface Mount Technology. 2021;33(5):291-298

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Henkel's Multicore® MP218 solder paste formulation delivers robust performance across a wide range of process conditions

Soldering & Surface Mount Technology. 2005;17(1):

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