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Computers in Industry. 1985;6(4):314
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Cantilever-Type Microelectromechanical Systems Probe Card with Through-Wafer Interconnects for Fine Pitch and High-Speed Testing
Japanese Journal of Applied Physics. 2004;43(6S):3877
Single wire fretting fatigue tests for electrical conductor bending fatigue evaluation
Wear. 1995;181-183:537-543
On the microstructural evolution in a 10% Cr martensitic steel during interrupted low cycle fatigue testing at 650 °C
International Journal of Fatigue. 2023;175:107806
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International Journal of Fatigue. 1989;11(2):134-134
Microstructural evolution during the crack propagation at the bond-wire contact area of IGBT power modules upon power cycling
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