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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
J Weld Join. 2021;39(6):677-683.   Published online 2021 December 6    DOI: https://doi.org/10.5781/JWJ.2021.39.6.13

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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Journal of Welding and Joining. 2021;39(6):677-683   Crossref logo
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