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Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang
JWJ. 2021;39(4):384-391.   Published online 2021 August 27    DOI: https://doi.org/10.5781/JWJ.2021.39.4.6

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Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Journal of Welding and Joining. 2021;39(4):384-391   Crossref logo
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Sinter-Bonding of Polycrystalline Silicon-Nitride Using Source Powder of Superplastic Ceramics as Insert Material
Materials Science Forum. 2004;449-452:225-228   Crossref logo
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Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles
Journal of Materials Research and Technology. 2020;9(6):16006-16017   Crossref logo
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High reliability silver paste for die bonding
Microelectronics Journal. 1989;20(3):50   Crossref logo
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Pressure-assisted sinter bonding method at 300 °C in air using a resin-free paste containing 1.5 μm Cu@Ag particles
Applied Surface Science. 2021;546:149156   Crossref logo
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Chip Sinter-Bonding Using Ag-Based Paste for Power Semiconductor Devices
Journal of Welding and Joining. 2019;37(5):482-492   Crossref logo
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Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer
Materials Science Forum. 2003;423-425:301-304   Crossref logo
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The chemical composition and bonding structure of amorphous hydrogenated carbon nitride film on aluminum surface deposited by electrodeposition
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Metallization-free silver sinter bonding to silicon via in situ decomposition of silver oxalate
Materials Letters. 2021;300:130205   Crossref logo
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Sinter bonding of inkjet-printed Ag die-attach as an alternative to Ag paste
Journal of Materials Science: Materials in Electronics. 2018;29(13):11421-11428   Crossref logo
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